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&&international communications in heat and mass transfer 怎么投稿啊
international communications in heat and mass transfer 怎么投稿啊
international communications in heat and mass transfer 怎么投稿啊？？？我进入的主页，根据提示一步步的进行，只有guide for authors和track your paper,并没有找到投稿入口submit your paper。然而别的期刊可以:sweat:！&&请各位帮助一下，怎么投稿呢
WA@SQPM{3OEK_1.jpg
5UKY4P3JRD3~HDP2[DPR8ZU.jpg
然后呢？？
什么然后？写得很清楚啊
投稿方式：邮寄三份稿件。
谢啦！郁闷为什么还用这么古老的邮寄方法！
那个老师都可以是吧！！
是邮局快件邮递？？其他地址邮编学院什么的都知道，但是需要老师电话号码啊？&&要怎么邮递呢？？
给这位编辑发email，问问他邮箱email给他行不行，
http://www./international-communications-in-heat-and-mass-transfer/editorial-board/p-cheng/#contact
今天通过邮局快件邮寄稿件给上海交通大学的郑平教授，但是不知道他的号码，快件得需要电话通知领取。&&除了这方式怎么邮寄稿件呢？&&谢谢啦
你好，楼主。我最近也打算投稿 international communications in heat and mass transfer ，但是也被搞的一头雾水，不知道往哪里投！请问你的这个录用了吗，
您好，网站“guide for author” 里面怎么没有投稿的格式要求呢？您知道在哪儿能找到吗？把那个author information pack下载下来也没找到，不知道行距、字体那些的该怎么调……麻烦您了
你好，现在我也遇到和你一样的情况了，现在你知道怎么修改格式了么可以分享一下吗谢谢
学术必备与600万学术达人在线互动！
扫描下载送金币君，已阅读到文档的结尾了呢~~
International Journal of Heat and Mass Transfer
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International Journal of Heat and Mass Transfer
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3秒自动关闭窗口W. Deng and A. Gomez, “Electrospray Cooling for Microelectronics,” International Journal of Heat and Mass Transfer, Vol. 54, No. 11-12, 2011, pp. .
doi:10.1016/j.ijheatmasstransfer.
被如下文章引用：
AUTHORS: ,
KEYWORDS: Electrospray C M Microfluidic C Electrostatic Field
JOURNAL NAME:
Sep 05, 2014
ABSTRACT: Thermal management of microelectronics demands higher heat flux removal capabilities due to the rapid increase in component and heat flux densities generated by integrated circuits (ICs). Electrospray evaporative cooling (ESEC) is a potential package-level thermal management solution for the next generation of microelectronics. In this paper, a design methodology is presented using numerical electrostatic field modeling to indirectly design proof-of-concept, micronozzle-based ESEC chambers. The results of the numerical modeling and heat transfer experiments indicate that the potential distribution near the micronozzle tip of the ESEC chamber dominates the heat transfer performance of ESEC cooling devices. The surface charge density at the micronozzle tips has a minor impact on the heat transfer performance. The maximum enhancement ratio of 1.87 was achieved by the 8-nozzle ESEC chamber at the lowest heat flux investigated, indicating that the heat transfer capability of ESEC chambers declines as the heat source density increases. The study demonstrates that increasing the number of micronozzles and decreasing the flow rate per nozzle may not effectively improve the heat transfer performance of ESEC devices.Heat and Mass Transfer - incl. option to publish open access
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Engineering
| Heat and Mass Transfer - incl. option to publish open access
W?rme- und Stoffübertragung
Editor-in-Chief: Andrea Luke
(print version)
(electronic version)
Journal no. 231
125,21&€
Personal Rate e-only
Covers the complete area of heat and mass transfer with relations to engineering thermodynamics and fluid mechanics
Publishes results from basic research as well as engineering applications, such as heat exchangers, process and chemical engineering
Covers experimental techniques as well as analytical and computational approaches
92% of authors who answered a survey reported that they would definitely publish or probably publish in the journal again
This journal serves the circulation of new developments in the field of basic research of heat and mass transfer phenomena, as well as related material properties and their measurements. Thereby applications to engineering problems are promoted. The journal is the traditional &W&rme- und Stoff&bertragung& which was changed to &Heat and Mass Transfer& back in 1995.
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By publishing original research reports &Heat and Mass Transfer& (W&rme- und Stoff&bertragung) serves the circulation of new developments in the field of basic research of heat and mass transfer phenomena, as well as related material properties and their measurements. Thereby applications to engineering problems are promoted. As of 1995 the title &W&rme- und Stoff&bertragung& was changed to &Heat and Mass Transfer&.
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